• 950-1650nm InGaAs Detector with Dual TEC, Photodiode Φ1000µm

    The P97MXXT2 series unit InGaAs detector consists mainly of a P-I-N structure InGaAs photosensitive chip, transition electrode plate, temperature sensor, and a dual-stage thermoelectric cooler (TEC), all housed in a TO package. This user manual specifically covers this series of products.

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    主要参数
  • 核心参数
  • 尺寸图
  • Main Parameters of the Detector

    Structural Parameters

    PN#

    Package

    Cooling Type

    Active Area (μm)

    Chip Size (μm)

    Electrode Size (μm)

    P97M03T2-A

    TO Package

    Dual-stage Cooling

    Φ300

    850×850

    140×180

    P97M05T2-A

    Φ500

    1000×1000

    140×180

    P97M10T2-A

    Φ1000

    1410×1410

    140×180

    P97M20T2-A

    Φ2000

    2560×2560

    280×360

    P97M30T2-A

    Φ3000

    3560×3560

    320×480

     


    Optoelectrical Parameters

    PN#

    Test Temperature Tch (℃)

    Spectral Response Range λ (μm)

    Dark Current ID (nA)

    Junction Capacitance C (f=1MHz, VR=0V) (pF)

    VR= 1V

    VR=5V

    P97M03T 2-A

    25

    0.95±0.05 to1.65±0.05

     

    Peak Value

    λP= 1.55

    0. 1

    0.5

    50

    P97M05T 2-A

    0.25

    1

    100

    P97M10T 2-A

    1

    4

    300

    P97M20T 2-A

    4

    10

    800

    P97M30T 2-A

    10

    40

    2000

     

    PN#

    Peak Responsivity S (A/W)

    Shunt Resistance Rsh (VR=10mV) (MΩ)

    Peak Detectivity D* (cm·Hz^(1/2)/W)

    Noise Equivalent Power NEP (W/Hz^(1/2))

    P97M03T2-A

    1.0

    3500

    3×1012

    8.9 × 10-15

    P97M05T2-A

    1000

    1.5 × 10-14

    P97M10T2-A

    300

    3.0×10-14

    P97M20T2-A

    80

    5.9 × 10-14

    P97M30T2-A

    40

    8.9 × 10-14

      

    Mechanical Structure and Electrical Interface

    The detector has dimensions of φ15.3mm × 10mm (excluding the pins). The bottom surface of the shell has 8 pins with a diameter of 0.45mm and a pin length of 13.5mm, which are used for TEC power supply, temperature sensor signal reading, and detector signal output. The design distance from the light-sensitive surface to the bottom of the window is 2.3mm, and the design distance from the mounting surface (i.e., the bottom of the shell) is 6.2mm. The window material is sapphire, with a thickness of 0.5mm, and the transparent area has a design diameter of φ9mm. The center of the light-sensitive surface is located at the center of the detector, with a positional offset of less than 0.3mm. The mechanical interface appearance and dimensions, as well as the optical and electrical interfaces, are shown in the figure.

     

    未标题-2.jpg


    Response Spectrum (Typical Value)

    2.png


    Thermal Parameters

    Operating Environment

    Parameter

    Typical Value

    Operating Temperature(℃)

    -45~+55

    Storage Temperature(℃)

    -50~+60

     

    Thermoelectric Cooler (TEC) Characteristics

    The detector integrates a two-stage thermoelectric cooler (TEC), with the center of the heat dissipation surface coinciding with the center of the detector's bottom surface. The heat dissipation area should be ≥ 6mm × 6mm. The performance parameters are as follows:

    Performance Specifications

    Value

    Max. Thermal Load Power (Qmax/W)

    0.93W

    Max. Allowed Load Current (ITEC-max/A)

    1A

    Max. Allowed Load Voltage (VTEC-max/V)

    2V

     

    Temperature Monitoring Module Characteristics

    The detector uses a thermistor as the temperature monitoring module. The resistance values corresponding to different temperatures within the operating range are shown in the table below:

    Temperature  ( ℃ )

    Resistance( kΩ)

    Temperature  ( ℃ )

    Resistance( kΩ)

    -65

    94.270

    -15

    6.909

    -60

    69.290

    -10

    5.587

    -55

    51.500

    -5

    4.549

    -50

    38.700

    0

    3.729

    -45

    29.400

    5

    3.075

    -40

    22.560

    10

    2.55

    -35

    17.490

    15

    2. 126

    -30

    13.690

    20

    1.782

    -25

    10.810

    25

    1.5

    -20

    8.608

    30

    1.268


    Thermistor Resistance-Temperature Relationship Formula

    3.png

    T1: Test target temperature, unit: °C;
    T2: Reference point temperature, unit: °C. The typical reference temperatures within the range of -2070°C are 10°C or 40°C. Choose a reference temperature close to the target temperature;
    R1: Thermistor resistance corresponding to T1, unit: kΩ;
    R2: Thermistor resistance corresponding to T2, unit: kΩ;
    B: The typical B10/40 value within -2070°C is 3019.6±60.

    Notes

    a) During the installation of the TEC, attention must be paid to the additional resistance introduced by external electrical structures. If the added resistance exceeds 10% of the TEC resistance, the I-V curve needs to be recalibrated.
    b) It is recommended to connect the TEC using a low-resistance method. If soldering is required, short-circuit grounding protection should be applied. The soldering temperature should be ≤250°C, and the soldering time should be <10s.
    c) If higher measurement accuracy is required within a small temperature range, the B value can be calculated according to specific requirements.
    d) Before turning on the TEC, ensure that the temperature monitoring module is functioning correctly, that the cooling surface has sufficient contact with the heatsink, and that the cooling surface area meets the required size. The heatsink should also be operational. The TEC should not be turned on without an installed or functioning heatsink.
    e) When turning on the TEC for the first time, start with 0A or 0V, gradually increase the current or voltage while monitoring the temperature changes until the preset temperature is reached.
    f) Since the performance of the detector is temperature-dependent, the TEC should be turned on to stabilize the temperature before the detector is turned on. It is not recommended to operate the detector in an environment with fluctuating temperatures.
    g) When the detector is not operating, the TEC should be powered off to extend its service life.
    h) The cooling effect of the detector is influenced by the ambient temperature, power supply performance, and cooling system status. It is recommended to design the cooling system appropriately based on the user's environment and performance requirements.

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